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  • 被动元件产品线--深圳市杰普特光电股份有限公司
    Hylax Direct Wafer Die Marking System 返回产品列表

    As the industry advances toward miniaturization and new materials composite on the wafer, the demand for wafer and individual die marking for traceability and identification has increased in the recent years. Capitalizing on our scanvision capability and laser knowledge, Hylax direct wafer die marking system is a fully automatic system designed for direct marking of dies in post sawn wafer form in wafer rings  and capable of processing up to 4” -8” wafer size.

    如需中文资料请E-mail:james@hylax.com

    Smart and accurate loading and unloading through robotic cassette scanning and wafer handling
    Fast and accurate laser marking through scanvision pre-alignment image technique
    Real time quality check method through incorporated post mark inspection
    Best consistent quality marking through dynamic focus height compensation for warp wafers
    Flexible marking layout and wafer mapping capability through data download from host link communication with SECS/GEM option
    Windows based user friendly interface software provides flexibility and rapid model change
    Low utility cost and maintenance-friendly design with intelligent diagnostic functions