Brittle Material Cutting & Splitting System Back To Product List

Ultrafast laser with compatible cutting head to cut brittle materials like sapphire glass, etc., and use CO2 laser system for splitting after the cutting.

  • Picosecond laser technologies to cut brittle materials like sapphire and glass with high efficiency. CO2 laser to split the cut material directly without extra loading / unloading
  • The use of 1064nm picosecond laser to obtain good laser quality and stable power
  • High speed, high precision ironless  linear motion stage to ensure high-precision and stable movement
  • Bessel beam cutting head to ensure high-quality cutting